FOCAL SPOT VERIFIER X-RAY MACHINE
- BGA solder joint quality inspection
- Manufacturing Process validation
- Rework verification
Our commitment to continuous improvement
- ISO 9001:2000 certified for box build and printed circuit board assembly.
- ISO 13485:2003 certified for box build and printed circuit board assembly.
- We have implemented a complete Continual Improvement, Quality Management System.
- Dedicated team to maintain, update, audit and execute Quality Management System.
The responsibility of TELIRITE employees is to do it right the first time. Customer specs and drawings are carefully checked before every assembly begins.
In addition to our physical inspection of completed PCB assemblies, our Continuous Improvement Philosophy has led us to use Automated Optical Inspection (AOI) systems to enhance our quality control of completed assemblies.
Every BGA on our PCB assemblies is inspected with our VERIFIER X-Ray Inspection System for bridging, missing, poor reflow shape and large voids.
SHENDENSHI ESV-304L AUTOMATED OPTICAL INSPECTION (AOI)
-Verifies optically the accuracy of the component placement to ensure
- Correct components are used
- Orientation of components are correct
- Missing components are identified
- Tombstoning is identified